IEC 60317-35:2000 pdf free download – Specifications for particular typesof winding wires
1Scope
This part of lEC 60317 specifies the requirements of solderable enamelled round copperwinding wire of class 155 with a dual coating. The underlying coating is based on poly-urethane resin,which may be modified providing it retains the chemical identity of the originalresin and meets all specified wire requirements.The superimposed coating is a bonding layerbased on a thermoplastic resin.
NOTE A modified resin is a resin that has undergone a chemical change,or contains one or more additives toenhance certain performance or application characteristics.
Class 155 is a thermal class that requires a minimum temperature index of 155 and a heatshock temperature of at least 175 ℃.
The temperature in degrees Celsius corresponding to the temperature index is not necessarilythat at which it is recommended that the wire be operated and this will depend on manyfactors, including the type of equipment involved.
The range of nominal conductor diameters covered by this standard is:
– Grade 1B: 0,020 mm up to and including 0,800 mm;
– Grade 2B: 0,020 mm up to and including 0,800 mm.
The nominal conductor diameters are specified in clause 4 of lEC 60317-0-1.
2 Normative references
The following normative documents contain provisions which，through reference in this text,constitute provisions of this part of lEC 60317.For dated references,subsequent amend-ments to, or revisions of，any of these publications do not apply. However，parties toagreements based on this part of lEC 60317 are encouraged to investigate the possibility ofapplying the most recent editions of the normative documents indicated below.For undatedreferences, the latest edition of the normative document referred to applies. Members of lECand lso maintain registers of currently valid International Standards.
IEC 60317-0-1:1990，Specifications for particular types of winding wires – Part 0: Generalrequirements – Section 1: Enamelled round copper wire.
18.1.1.1 At room temperature
The specimens shall be prepared according to the test method,and the temperature of theoven for bonding shall be fixed as agreed between purchaser and supplier for the differenttypes of bonding enamels. The suggested temperature for polyamide bonding enamelis (200±2) C and the suggested temperature for polyvinyl butyral bonding enamel is(170±2) ℃.
Results: when testing the specimens according to the test method,under the action of loadspecified in table 2, no turns other than possibly the first and the last shall be separated.
18.1.1.2 At elevated temperature
The specimens shall be prepared and shall be conditioned as described in the test method.
The elevated temperature shall be fixed as agreed between purchaser and supplier for thedifferent types of bonding enamels.The suggested temperature for polyamide bonding enamel is(155±2)C and the suggested temperature for polyvinyi butyral bonding enamel is (90 ±2)℃.
18.1.2.1 At room temperature
When preparing a test specimen of diameter 0,315 mm according to the test method, the timeshall be 30 s and the current shall be fixed as agreed between purchaser and supplier. Thesuggested value for polyamide or polyvinyl butyral bonding enamel is (2,7±0,1)A.
Results: when testing the specimens according to the test method，under the action of thedeflection force of 100 N, the specimen shall not be broken.