ANSI SP27.1:2018 pdf free download – For the Recommended Information Flow for Potential EOS Issues between Automotive OEM, Tier 1, and Semiconductor Manufacturers
design validation or design verification (DV). Verifying the design of the electronic component or the module without including the effects of automotive manufacturing induced variations in the module and vehicle production. diagnostic trouble code (DTC). DTC codes that are described by Society of Automotive Engineers (SAE) standards to help track problems in a vehicle detected by its on-board computer. electronic control unit (ECU). An embedded electronic system that controls one or more electrical systems or subsystems in a vehicle. NOTE: An ECU typically includes one or more printed circuit board assemblies (PCBA’s). electrically induced physical damage (EIPD). Damage to an electronic component due to electrical/thermal stress beyond the level which the materials could sustain. NOTE: This would include melting of silicon, fusing of metal interconnects, thermal damage to package material, fusing of bond wires and other damage caused by excess current or voltage. NOTE: The term EIPD has to be used during initial failure analysis/failure investigation until a more comprehensive joint analysis between supplier and customer has confirmed a potential EOS event. NOTE: Thermal stress is assumed to be a consequence of electrical stimulation. electronic component. In the context of this document an electronic component describes an integrated circuit (IC), a semiconductor device, a passive device, or a discrete device. electrical overstress (EOS). An electrical device suffers electrical overstress when a maximum limit for either the voltage across, the current through, or the power dissipated in the device is exceeded and causes immediate damage or malfunction, or latent damage resulting in an unpredictable reduction of its lifetime.
4.0 TWO LEVEL FAILURE ANALYSIS REPORT SUPPORT
Typically, modules that are claimed to be damaged during manufacturing or use are sent back by the OEM to the Tier 1 . The suspect electronic component is then sent to the semiconductor manufacturer. The semiconductor manufacturer typically has to do a failure analysis and the Tier 1 and/or the semiconductor manufacturer tries to reproduce the damage by a simulation experiment in the lab. Reproducing the damaging process can be difficult without knowledge of or access to the complex system environment and might not identify the correct damaging stress. All these actions are very costly, time consuming, and involve considerable resources of all parties. Without good cooperation between all tier levels, a possible stress condition that could lead to this signature may be found but not the root cause of the problem. This is especially true if the problem only randomly appears. In this case, it is almost impossible to find the root cause. To avoid an excessive amount of effort that will not result in a solution of the problem, various levels of support are defined in this Standard Practice depending on the actual situation where the damage happens (see Table 1 ). These levels require different information from all parties involved (OEM, Tier 1 (and sub-tiers), and semiconductor manufacturer).