BS IEC 60748-11:2000 pdf free download – Semiconductor devices – Sectional specification for semiconductor integrated circuits excluding hybrid circuits
2.4.3 Changes in manufacturing operations
1) Definition of major changes Any change in manufacturing process or technology which could affect the quality or performance of a product supplied to an approved specification, or which could require a product to be transferred from one structural similarity group of circuits to another (new or existing) group (see Clause 6 below) represents a change considered as major. It is the responsibility of the Chief Inspector to decide whether the change is major or not. Some examples of major changes are given in 3) below.
2) Procedure in the event of a major change Any major change shall only be implemented with notification and demonstration by test evidence of maintenance of quality to the NSI.
3) Examples of major changes
a) Die attach
— from eutectic solder to epoxy attachment.
Not considered as a major change: equipment change without changing the technology or the use of preform instead of gold plated alloy surfaces.
b) Crystal passivation
— from silicon-nitride to silicon-oxide;
— sequence of the passivation layers.
Not considered as a major change: changing of the method of deposition of the passivation layers.
c) Package material
— from ceramic to plastic;
— from plastic A to plastic B.
d) Metallization
— from gold to aluminium metallization.
e) Die size and/or die layout
— introduction of guard-rings and/or barrier layers.
f) Bonding
— from the thermo-compression to the ultrasonic method;
— from gold bond wire to aluminium wire.
g) Functional verification during quality conformance inspection
— any reduction of test sequences in the test programs.
— the subcontracted manufacturing process may be either the diffusion process or the assembly process, including screening steps which are incorporated in them. Screening operation applied after assembly process may also be independently subcontracted. The finishing process can only be subcontracted together with the complete assembly process, except for the lead plating operation which may be subcontracted separately (see 2.4.1 above).
The Chief Inspector shall be provided and shall agree with the procedures for the transfer of the parts from the place of manufacture to the manufacturer within the IECQ geographical area who is certifying the component. The NSI shall be informed and have access to the applicable documents. Any changes in inspection requirements and manufacturing procedures shall be reported back to the Chief Inspector who is certifying the components. The major changes shall be reported by the approved Chief Inspector to the NSI (see 2.4.3 above). The approved manufacturer shall perform the acceptance tests prescribed by the detail specification for the component he is certifying. He can perform the acceptance tests in a facility outside the IECQ geographical area, provided that this facility is supervised by the NSI. Acceptance tests can be subcontracted to approved test laboratories within the IECQ geographical area.