IEC 60317-19:2000 pdf free download – Specifications for particular typesof winding wires
1Scope
This International Standard specifies the requirements of solderable enamelled round copperwinding wire of class 130 with a dual coating. The underlying coating is based onpolyurethane resin，which may be modified providing it retains the chemical identity of theoriginal resin and meets all specified wire requirements. The superimposed coating is basedon polyamide resin.
NOTE A modified resin is a resin that has undergone a chemical change,or contains one or more additives toenhance certain performance or application characteristics.
Class 130 is a thermal class that requires a minimum temperature index of 130 and a heatshock temperature of at least 155 ℃.
The temperature in degrees Celsius corresponding to the temperature index is not necessarilythat at which it is recommended that the wire be operated and this will depend on manyfactors, including the type of equipment involved.
The range of nominal conductor diameters covered by this standard is:
– Grade 1: 0,050 mm up to and including 1,600 mm;
– Grade 2: 0,050 mm up to and including 2,000 mm.
The nominal conductor diameters are specified in clause 4 of lEC 60317-0-1.
2 Normative references
The following standard contains provisions which，through reference in this text,constituteprovisions of this International Standard.At the time of publication, the edition indicated wasvalid. All standards are subject to revision，and parties to agreements based on thisInternational Standard are encouraged to investigate the possibility of applying the mostrecent edition of the standard indicated below.Members of lEC and lSo maintain registers ofcurrently valid international standards.
IEC 60317-O-1:1990，Specifications for particular types of winding wires – Part 0: Generalrequirements – Section ‘1: Enamelled round copper wire.
14 Continuity of insulationSee clause 14 of lEC 60317-O-1.15 Temperature index
See clause 15 of lEC 60317-0-1, where the minimum temperature index shall be 130.
16 Resistance to refrigerants
Test inappropriate.
17 Solderability
17.1 Nominal conductor diameters up to and including 0,050 mm
The temperature of the solder bath shall be 375 ℃ ± 5 C.The maximum immersion timeshall be 2 s.
The surface of the tinned wire shall be smooth and free from holes and enamel residues.17.2 Nominal conductor diameters over 0,050 mm up to and including 0,100 mm
The temperature of the solder bath shall be 375 ℃ ± 5 C. The maximum immersion timeshall be 2 s.
The surface of the tinned wire shall be smooth and free from holes and enamel residues.17.3 Nominal conductor diameter over 0,100 mm
The temperature of the solder bath shall be (375 ±5)℃. The maximum immersion time(in seconds) shall be the following multiple of the nominal conductor diameter (in millimetres)with a minimum of 2 s.