IEC 61837-3:2000 pdf free download – surface mounted piezoelectric devicesfor frequency control and selection – Standard outlines and terminal lead connections
1Scope
This part of lEC 61837 deals with standard outlines and terminal lead connections as theyapply to SMDs for frequency control and selection in metal enclosures and is based onlEC 61240.
2Normative references
The following normative documents contain provisions which,through reference in this text,constitute provisions of this part of IEC61837. For dated references，subsequentamendments to,or revisions of, any of these publications do not apply.However,parties toagreements based on this part of lEC 61837 are encouraged to investigate the possibility ofapplying the most recent editions of the normative documents indicated below.For undatedreferences, the latest edition of the normative document referred to applies.Members of lECand lso maintain registers of currently valid International Standards.
IEC 61240:1994，Piezoelectric devices – Preparation of outline drawings of surface mounteddevices (SMD) for frequency control and selection – General rules
3Configuration of enclosures
The enclosures of the surface-mounted devices are made of metal with the formed leadterminals based on the descriptive designation system for semiconductors – devices package.The configuration symbols are shown as follows:
– DCC(dual chip carrier);
– OCC(quad chip carrier);
– SS (special surface-mounted).
5Metal enclosure dimensions
The dimensions given in this standard apply to all the completed SMD for frequency controland selection. Only those dimensions are given which meet the requirements of lEC 61240.
6 Lead connections
Recommendations for the lead connections of all completed SMD for frequency control andselection，except SS-types, are given in the following individual sheets.Lead connectionsshall always be given in the detail specification.
7 Designation of metal enclosures
The following table sets out the designation of the metal enclosures as outlined in the ensuingspecification sheets.
IEC 60122-2:1983,Quartz crystal units for frequency control and selection – Part 2: Guide tothe use of quartz crystal units for frequency control and selection
IEC 60122-3:1977,Quartz crystal units for frequency control and selection – Part 3: Standardoutlines and pin connections
Amendment 2 (1991)
Amendment 3 (1992)Amendment4 (1993)
IEC 60191-6:1990，Mechanical standardization of semiconductor devices – Part 6: Generalrules for the preparation of outline drawings of surface mounted semi-conductor devicepackages
IEC 60368-1:2000，Piezoelectric filters of assessed quality – Part 1 : Generic specification
IEC 60368-2-1:1988，Piezoelectric filters – Part 2: Guide to the use of piezoelectric filters -Section One: Quartz crystal filters
IEC 60368-2-2:1996,Piezoelectric filters – Part 2: Guide to the use of piezoelectric filters -Section 2: Piezoelectric ceramic filters
IEC 60368-3:1991，Piezoelectric filters – Part 3: Standard outlines
IEC 60679-1:1997,Quartz crystal controlled oscillators of assessed quality – Part 1 : Genericspecification
IEC 60679-2:1981，Quartz crystal controlled oscillators – Part 2: Guide to the use of quartzcrystal controlled oscillators
IEC 60679-3:1989，Quartz crystal controlled oscillators – Part 3: Standard outlines and leadconnections
First supplement (1991)Amendment 1 (1994)
IEC60862-1:1989，Surface acoustic wave (SAW) filters – Part 1: General information,standard values and test conditions – Chapter !: General information and standard values -Chapter ll: Test conditions
IEC 60862-2:1991，Surface acoustic wave (SAW) filters – Part 2: Guide to the use of surfaceacoustic wave filters (Chapter l)
IEC 60862-3:1986,Surface acoustic wave(SAW) filters – Part 3:Standard outlines(Chapter lv)
IEC 61019-1-1:1990，Surface acoustic wave (SAW) resonators – Part 1: General information,standard values and test conditions – Section 1: General information and standard values